Wafer Process Quals

Our specialty is to devise, and execute Process and Technology Qualification of Test Chips, Standard products, ASICs, FPGA’s Memories, and all other logic products.

Advanced capabilities of system level, device level, Component level reliability validation using functionality system level test, burn-in, and bench burn-in conducted at maximum possible ambient, maximum possible junction giving it the shortest fastest most accurate assessment using the techniques we deploy. Air burn-in, liquid burn-in, junction-managed burn-in, and system-level burn-in.

Building upon the process Wafer and Foundry Processing data a Qualification and characterization plan is devised that looks at Early Failure Rate and Long-Term Performance of technologies.

Foundry-specific tests and technological benchmarking, characterization tests, are designed with ATE test hardware, Reference board design, biasing and stress hardware, Burn-in, and HTOL Boards.

The centerpiece of this is our Life Test Burn in or HOTL Services

Low power Dynamic
Static and functional Burn-in
Test during Burn-in
At speed intelligent Burn-in
Ambient low-power air flow managed Burn-in
Thermally-managed and junction-managed Burn-in
Real-time water/heater-controlled Burn-in for High Power dissipation
Reference card and System Level Test Burn-in
Level I and systems level II Burn-in
Power cycling and application-specific Burn-in
COTS Qualification & PEM & Qualification Services
On Going Reliability Monitors (ORM,s)
Advanced Chamber less Burn-in (RF device testing)

Specialty in HTOL/EFR Testing

Leading edge technology/ies require precision, accuracy, and real-time management during burn-in
iTest deploys leading edge burn-in ovens complimented with smart data acquisition techniques to ensure technology evaluation is correctly performed
iTest Designs and Develops Custom Boards for each design
Customer Evaluation Board/Subset can be integrated on the Burn-in Board
Extensive monitoring of device sign of life during Burn
Real time junction monitoring and thermal regulation
Signal integrity with true accurate factors
Voltage and Current transient controls with added suppressant/capacitive controls