iTest Inc.
iTest Inc.

Analytical Services

Reliability Test Services

  • Characterize devices for a wide array of electrical functions, mechanical and environmental stresses to ascertain accurate FIT rates.
  • Accelerated Evaluation & Qualification
  • Board-level Solder Joint Reliability
  • Device characterization / Feasibility Analysis
  • Multiple package/product evaluation
  • High-powered, liquid and RF burn-in
  • Acoustic Microscopy
  • EFR Analysis
  • Particle Impact Noise Detection (PIND)
  • Salt Atmosphere
  • Shadow Moiré/Warpage Analysis
  • Solderability
  • X-Ray
  • Other Level III & Sub System
  • Hermetic package testing

Failure Analysis

  • Photography and Optical Microscopy
  • Radiography Inspection (X-Ray)
  • Cross-Section
  • Decapsulation
  • Scanning Electron Microscopy (SEM)
  • Energy Dispersive Spectroscopy (EDS/EDX)
  • Scanning Acoustic Microscopy
  • Emission Microscope (EMMI)
Related
Related

Services

ESD Testing
ESD Testing

Latch-Up
Latch-Up

Package Qualifications
Package Qualifications

Wafer Process Quals
Wafer Process Quals

Environmental Testing
Environmental Testing

Analytical Services
Analytical Services

Facebook Twitter Linkedin